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A157 wl- csp packages ・ ・ p. Ic packages ics contents qfp packages ・ ・ p. A154 power packages ・ ・ p. A150 hsop packages ・ ・ p. 27mm) from the next.
1 introduction this note is a snapshot of electrical performance of national' s ic packages. To facilitate the packaging and handling of ic chips to dissipate heat generated by ic chips to protect the electrical characteristics of the ic standard dual- in- line packages ( dip), which fulfill these basic requirements, have enjoyed wide usage in the electronics industry for a number of years. A device, usually an integrated circuit ( ic) package containing a thermal test chip that can both dissipate power and measure the maximum chip temperature, is mounted on a test board. This application report provides customers answers to the most frequently asked questions and allows them to review the different methods used to pack our products. Other, similar ic packages include tsop ( thin small- outline package) and tssop ( thin- shrink small- outline package). A154 non- lead packages ・ ・ p. These packages are among the easiest smd parts to hand solder.
The ssop ( shrink small- outline package) is an even smaller version of soic packages. The temperature sensing component of the test chip is calibrated. On soic packages, each pin is usually spaced by about 0. A159 lapis semiconductor packages sop packages ・ ・ p. It is provided to help designers get an idea about electrical parasitics associated with the package, and help them compare the electrical performance of different packages. Θja - 6, - 7, and - 9) : step 1.
Introduction this application report describes in detail the methods used by the ti standard linear & logic ( sll) business unit to pack semiconductor devices ( components). A147 sop packages ・ ・ p. A161 qfp packages ・ ・ p. A164 qfn packages A152 small packages ・ ・ p. A144 son / qfn packages ・ ・ p.
A155 bga packages ・ ・ p.
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